C26800 zinc brass wire
C26800 copper wire is a copper-zinc alloy (brass) with a zinc content of about 33%. It has good processing properties, mechanical strength and conductivity and is widely used in electronic components, fasteners, decorations and other fields.
Parameter
Chemical Composition
Mechanical Properties

Size range

Conventional industrial wire:


The diameter range is usually 0.52±0.02mm (corresponding to 24AWG wire gauge), and 3.3mm~3.9mm coiled wire.

Other specifications can be customized according to requirements, such as wire sizes specified by ASTM B134 standard.

Special application areas:


The diameter range of high-purity copper wire (HC series) for semiconductor bonding is 18~50 microns, which can be expanded to more than 75 microns according to requirements. However, such micron-grade copper wire may belong to other grades (such as HC) and needs to be distinguished from C26800.


International standards

Grade comparison:


China: H66/C26800 in GB/T 5231-2012 (processing copper alloy grades) and GB/T 2040-2017 (copper alloy plate).

USA: UNS C26800, ASTM B134 (wire), ASTM B36 (plate).

Japan: JIS C2680.

Europe: EN CW506L.

International: ISO CuZn34.

Performance and process standards:


The wire material must meet the requirements of TR type soft round copper wire in GB/T 3953-2009, and the elongation at break must be ≥15%.

The hardness states include soft state (H00), semi-hard state (H02), hard state (H04), etc. The Vickers hardness range varies depending on the state (e.g. soft state ≤90 HV, hard state 120~160 HV).


Chemical composition (mass percentage):

Copper (Cu): 64.0%~68.5%

Zinc (Zn): Balance (about 31%~36%)

Lead (Pb): ≤0.15% (some standards such as ASTM stipulate ≤0.09%)

Iron (Fe): ≤0.05%

Other elements: such as boron (B) ≤0.01%, bismuth (Bi) ≤0.002%, etc., total impurity ≤0.45%



Mechanical properties vary significantly with processing conditions (such as annealing, cold working), and common conditions include H00 (soft state) to H10 (full hard state). Take the typical state as an example:


Annealed state (OS035):


Tensile strength: 345 MPa (50 ksi)

Elongation: 60%

Shear strength: 234 MPa (34 ksi)

Semi-hard state (H02):


Tensile strength: 607 MPa (88 ksi)

Elongation: 15%

Full hard state (H04):


Tensile strength: 758 MPa (110 ksi) or 510 MPa (74 ksi) (different test standards or data sources)

Elongation: 8%

Yield strength: 420 MPa (60 ksi)

Brinell hardness: 80 HB

Other conditions (H08):


Tensile strength: 883 MPa (128 ksi)

Elongation: 3%

Physical properties:

Melting point: liquidus 930°C (1710°F), solidus 904°C (1660°F)

Density: 8.1~8.47 g/cm³

Electrical conductivity: 27% IACS (International Annealed Copper Standard)

Thermal conductivity: 116~120 W/m·K

Coefficient of thermal expansion: 20~20.3 µm/m·°C (70~572°F)

Application and processing characteristics:

Corrosion resistance: good, but avoid contact with ammonia, mercury or acidic media to prevent stress corrosion or dezincification.

Processing performance:

Excellent cold working ability, suitable for stamping, drawing and other processes.

Poor hot forming ability, recommended annealing temperature 540~600°C (annealed state) or 800~1300°F (stress relief after cold working).

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